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DATA SHEET
MOS INTEGRATED CIRCUIT
PD3778
10600 PIXELS x 3 COLOR CCD LINEAR IMAGE SENSOR
The PD3778 is a color CCD (Charge Coupled Device) linear image sensor which changes optical images to electrical signal and has the function of color separation. The PD3778 has 3 rows of 10600 pixels, and each row has a double-sided readout type of charge transfer register. And it has reset feed-through level clamp circuits and voltage amplifiers. Therefore, it is suitable for 1200 dpi/A4 color image scanners and so on.
FEATURES
* Valid photocell * Photocell size * Line spacing * Color filter * Resolution : 10600 pixels x 3 : 4 x 4 m2 : 48 m (12 lines) Red line-Green line, Green line-Blue line : Primary colors (red, green and blue), pigment filter (with light resistance 107 lx*hour) : 48 dot/mm A4 (210 x 297 mm) size (shorter side) 1200 dpi US letter (8.5" x 11") size (shorter side) * Drive clock level : CMOS output under 5 V operation * Data rate * Power supply : 5 MHz MAX. : +12 V Voltage amplifiers
* Photocell's pitch : 4 m
* On-chip circuits : Reset feed-through level clamp circuits
ORDERING INFORMATION
Part Number Package CCD linear image sensor 32-pin plastic DIP (400 mil)
PD3778CY
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. S14374EJ1V0DS00 (1st edition) Date published July 1999 N CP(K) Printed in Japan
(c)
1999
S10599
VOUT1 (Blue)
30
........
Photocell (Blue)
S10600
D14
D64
D65
D66
Transfer gate CCD analog shift register
Data Sheet S14374EJ1V0DS00
CCD analog shift register Transfer gate
S10599
D67
S1
S2
VOUT2 (Green)
31
........
Photocell (Green)
S10600
D14
D64
D65
D66
Transfer gate CCD analog shift register
CCD analog shift register Transfer gate
S10599
D67
S1
S2
VOUT3 (Red)
32
........
Photocell (Red)
S10600
D14
D64
D65
D66
Transfer gate CCD analog shift register
D67
S1
S2
2
BLOCK DIAGRAM
VOD 29 GND 1 GND 16
2
22
1
19
CCD analog shift register Transfer gate 18
TG1 (Blue)
17
TG2 (Green)
15
TG3 (Red)
3
2
14
11
PD3778
CLB
RB
2
1
PD3778
PIN CONFIGURATION (Top View) CCD linear image sensor 32-pin plastic DIP (400 mil)
* PD3778CY
Ground Reset gate clock Reset feed-through level clamp clock No connection No connection Internal connection Internal connection No connection No connection No connection Shift register clock 1 Internal connection Internal connection Shift register clock 2 Transfer gate clock 3 (for Red) Ground
GND
1 2
32 31
VOUT3 VOUT2 VOUT1 VOD NC IC IC NC NC NC
Output signal 3 (Red) Output signal 2 (Green) Output signal 1 (Blue) Output drain voltage No connection Internal connection Internal connection No connection No connection No connection Shift register clock 2 Internal connection Internal connection Shift register clock 1 Transfer gate clock 1 (for Blue) Transfer gate clock 2 (for Green)
RB CLB
NC NC IC IC NC NC NC
1
1
3 4 5 6 7 8 9 10 11 12 13 14 15 16
1
30 29 28 27 26 25 24 23 22 21 20 19 18 17
Green
1
IC IC
Blue
Red
2
IC IC
10600
10600
TG3
GND
10600
2
1 TG1 TG2
Caution Leave pins 6, 7, 12, 13, 20, 21, 26, 27 (IC) unconnected.
Data Sheet S14374EJ1V0DS00
3
PD3778
PHOTOCELL STRUCTURE DIAGRAM PHOTOCELL ARRAY STRUCTURE DIAGRAM (Line spacing)
4 m 2 m 2 m
4 m
Blue photocell array
12 lines (48 m) Green photocell array 12 lines (48 m)
4 m
Channel stopper
4 m
Red photocell array
Aluminum shield
4
Data Sheet S14374EJ1V0DS00
PD3778
ABSOLUTE MAXIMUM RATINGS (TA = +25 C)
Parameter Output drain voltage Shift register clock voltage Reset gate clock voltage Reset feed-through level clamp clock voltage Transfer gate clock voltage Operating ambient temperature Storage temperature VOD V1, V2 VRB VCLB VTG1 to VTG3 TA Tstg Symbol Ratings -0.3 to +15 -0.3 to +8 -0.3 to +8 -0.3 to +8 -0.3 to +8 -25 to +60 -40 to +70 Unit V V V V V C C
Caution Exposure to ABSOLUTE MAXIMUM RATINGS for extended periods may affect device reliability; exceeding the ratings could cause permanent damage. The parameters apply independently.
RECOMMENDED OPERATING CONDITIONS (TA = +25 C)
Parameter Output drain voltage Shift register clock high level Shift register clock low level Reset gate clock high level Reset gate clock low level Reset feed-through level clamp clock high level Reset feed-through level clamp clock low level Transfer gate clock high level Transfer gate clock low level Data rate VOD V1H, V2H V1L, V2L VRBH VRBL VCLBH VCLBL VTG1H to VTG3H VTG1L to VTG3L fRB Symbol MIN. 11.4 4.5 -0.3 4.5 -0.3 4.5 -0.3 4.5 -0.3 - TYP. 12.0 5.0 0 5.0 0 5.0 0 V1HNote 0 1.0 MAX. 12.6 5.5 +0.5 5.5 +0.5 5.5 +0.5 V1HNote +0.5 5.0 Unit V V V V V V V V V MHz
Note
When Transfer gate clock high level (VTG1H to VTG3H) is higher than Shift register clock high level (V1H), Image lag can increase.
Data Sheet S14374EJ1V0DS00
5
PD3778
ELECTRICAL CHARACTERISTICS
TA = +25 C, VOD = 12 V, data rate (fRB) = 2 MHz, storage time = 5.5 ms, input signal clock = 5 Vp-p, light source: 3200 K halogen lamp +C-500S (infrared cut filter, t = 1mm) + HA-50 (heat absorbing filter, t = 3 mm)
Parameter Saturation voltage Saturation exposure Red Green Blue Photo response non-uniformity Average dark signal Dark signal non-uniformity Power consumption Output impedance Response Red Green Blue Image lag Offset level
Note1 Note2
Symbol Vsat SER SEG SEB PRNU ADS DSNU PW ZO RR RG RB IL VOS td TTE
Test Conditions
MIN. 2.0
TYP. 2.5 0.694 0.757 1.250
MAX. -
Unit V lx*s lx*s lx*s
VOUT = 1.0 V Light shielding Light shielding
6 0.2 1.5 400 0.5 2.52 2.31 1.40 3.60 3.30 2.00 2.0 4.0 6.0 50 92 98
20 4.0 4.0 600 1 4.68 4.29 2.60 10.0 7.0
% mV mV mW k V/lx*s V/lx*s V/lx*s % V ns %
VOUT = 1.0 V
Output fall delay time
VOUT = 1.0 V VOUT = 1.0 V, data rate = 5 MHz
Total transfer efficiency
Register imbalance Response peak Red Green Blue Dynamic range
RI
VOUT = 1.0 V
0
1.0 630 540 460
4.0
% nm nm nm times times
DR1 DR2
Vsat /DSNU Vsat / CDS Light shielding Light shielding -1000 -
1666 2500 -300 1.0 +500 -
Reset feed-through noise Random noise (CDS)
Note1
RFTN CDS
mV mV
Notes 1. Refer to TIMING CHART 2. 2. When each fall time of 1 and 2 (t2, t1) is the TYP. value (refer to TIMING CHART 2).
6
Data Sheet S14374EJ1V0DS00
PD3778
INPUT PIN CAPACITANCE (TA = +25 C, VOD = 12 V)
Parameter Shift register clock pin capacitance 1 Symbol C1 Pin name Pin No. 11 19 Shift register clock pin capacitance 2 C2 MIN. TYP. 400 400 400 400 15 15 120 120 120 MAX. Unit pF pF pF pF pF pF pF pF pF
1
2
14 22
Reset gate clock pin capacitance
CRB
RB CLB TG1 TG2 TG3
2 3 18 17 15
Reset feed-through level clamp clock pin capacitance CCLB Transfer gate clock pin capacitance CTG
Remark Pins 11 and 19 (1), 14 and 22 (2) are each connected inside of the device.
Data Sheet S14374EJ1V0DS00
7
1
2
3
4
5
6
7
1 2 RB CLB
8
Note
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
10663 10664 10665 10666 10667 10668 10669
VOUT1 to VOUT3
Optical black (49 pixels) Invalid photocell (2 pixels)
61 62 63 64 65 66
8
Data Sheet S14374EJ1V0DS00
TIMING CHART 1 (for each color)
TG1 to TG3
Note
Valid photocell (10600 pixels) Invalid photocell (3 pixels)
Note Input the RB and CLB pulses continuously during this period, too.
PD3778
TIMING CHART 2 (for each color)
t1 t2
1
90 % 10 %
2
t5 t6
90 % 10 % t3 t4
RB
90 % 10 % t10 90 % 10 % t8 t7 t9 t11
Data Sheet S14374EJ1V0DS00
CLB
+
td RFTN td
VOUT VOS 10 %
_
RFTN 10 %
PD3778
9
PD3778
TG1 to TG3, 1, 2 TIMING CHART
t13 90 % t12 t14
TG1 to TG3
10 % t15 90 % t16
1
2
Symbol t1, t2 t3 t4 t5, t6 t7 t8, t9 t10 t11 t12 t13, t14 t15, t16
MIN. 0 20 70 0 30 0 30 5 5000 0 900
TYP. 25 50 250 25 50 25 50 15 10000 50 1000
MAX. - - - - - - - - - - -
Unit ns ns ns ns ns ns ns ns ns ns ns
1, 2 cross points
1
2.0 V or more
2
2.0 V or more
Remark Adjust cross points of 1 and 2 with input resistance of each pin.
10
Data Sheet S14374EJ1V0DS00
PD3778
DEFINITIONS OF CHARACTERISTIC ITEMS
1. Saturation voltage: Vsat Output signal voltage at which the response linearity is lost. 2. Saturation exposure: SE Product of intensity of illumination (IX) and storage time (s) when saturation of output voltage occurs. 3. Photo response non-uniformity: PRNU The output signal non-uniformity of all the valid pixels when the photosensitive surface is applied with the light of uniform illumination. This is calculated by the following formula.
PRNU (%) = x x 100 x x : maximum of xj - x
10600 j=1
xj
x=
10600
xj : Output voltage of valid pixel number j
VOUT
Register Dark DC level
x x
4.
Average dark signal: ADS Average output signal voltage of all the valid pixels at light shielding. This is calculated by the following formula.
10600 j=1
dj
dj : Dark signal of valid pixel number j
ADS (mV) =
10600
5.
Dark signal non-uniformity: DSNU Absolute maximum of the difference between ADS and voltage of the highest or lowest output pixel of all the valid pixels at light shielding. This is calculated by the following formula.
DSNU (mV) : maximum of dj - ADS j = 1 to 10600 dj : Dark signal of valid pixel number j
VOUT ADS Register Dark DC level DSNU
Data Sheet S14374EJ1V0DS00
11
PD3778
6. Output impedance: ZO Impedance of the output pins viewed from outside. 7. Response: R Output voltage divided by exposure (Ix*s). Note that the response varies with a light source (spectral characteristic). 8. Image Lag: IL The rate between the last output voltage and the next one after read out the data of a line.
TG
Light
ON
OFF
VOUT V1 VOUT
V1 IL (%) = VOUT
x100
9.
Register imbalance: RI The rate of the difference between the averages of the output voltage of Odd and Even pixels, against the average output voltage of all the valid pixels.
n
2 n RI (%) =
(V2j - 1 - V2j)
j= 1
2
1 n
Vj
j= 1
n
x 100
n : Number of valid pixels Vj : Output voltage of each pixel
12
Data Sheet S14374EJ1V0DS00
PD3778
10. Random noise (CDS): CDS Random noise (CDS) CDS is defined as the standard deviation of a valid pixel output signal with 100 times (= 100 lines) data sampling at dark (light shielding). This is measured by the following procedure. 1. One valid photocell in one reading is fixed as measurement point. 2. The output level is measured during the Reset feed-through period which is averaged over 100 ns to get "VDi". 3. The output level is measured during the Video output time averaged over 100 ns to get "VOi". 4. The correlated double sampling output is defined by "VCDSi = VDi - VOi". 5. Repeat the above procedure (1 to 4) for 100 times (= 100 lines). 6. Calculate the standard deviation CDS using the following formula.
100
CDS (mV) =
(VCDSi - V)
i=1
2
, V=
1
100
100
100 i=1
VCDSi
Reset feed-through
VOUT
Video output
Data Sheet S14374EJ1V0DS00
13
PD3778
STANDARD CHARACTERISTIC CURVES (Nominal)
DARK OUTPUT TEMPERATURE CHARACTERISTIC 8 2
STORAGE TIME OUTPUT VOLTAGE CHARACTERISTIC (TA = +25 C)
4 Relative Output Voltage Relative Output Voltage 10 20 30 40 50 1
2
1
0.5
0.25
0.2
0.1 0
0.1
1
5 Storage Time (ms)
10
Operating Ambient Temperature TA(C)
TOTAL SPECTRAL RESPONSE CHARACTERISTICS (without infrared cut filter and heat absorbing filter) (TA = +25 C) 100 R
B 80
G
Response Ratio (%)
60
40
G 20
B 0 400 500 600 Wavelength (nm) 700 800
14
Data Sheet S14374EJ1V0DS00
PD3778
APPLICATION CIRCUIT EXAMPLE
PD3778
1 GND 47 VOUT3 31 VOUT2 30 VOUT1 29 NC 5 NC +5 V 6 IC 7 IC + 8 NC 10 F/16 V 0.1 F 9 NC 10 NC 4.7 NC 11 12 IC 13 IC 4.7 IC 14 15 16 GND IC 20 19 18 17 4.7 4.7 4.7 NC 23 22 21 4.7 0.1 F 10 F/16 V NC + 24 25 IC IC 26 +5 V NC 27 0.1 F 47 F/25 V VOD + 28 B1 10 B2 +12 V 2 3 4 32 B3
RB
47
RB CLB
CLB
1
1
2
2
4.7
2 TG3
1 TG1 TG2
TG
Caution Leave pins 6, 7, 12, 13, 20, 21, 26, 27 (IC) unconnected. Remark The inverters shown in the above application circuit example are the 74HC04 or 74AC04.
Data Sheet S14374EJ1V0DS00
15
PD3778
B1 to B3 EQUIVALENT CIRCUIT 12 V + 100 CCD VOUT 100 2SC945 47 F/25 V
2 k
16
Data Sheet S14374EJ1V0DS00
PD3778
PACKAGE DRAWING
CCD LINEAR IMAGE SENSOR 32-PIN PLASTIC DIP (400 mil)
(Unit : mm) 1st valid pixel 6.150.3 32
1
17
9.050.3
12.60.5 1 4.10.5 54.80.5 55.20.5 16
9.250.3
10.16 (1.80)
2
(5.42) 1.020.15 0.460.06 38.1 4.550.5 2.54 4.210.5
0~1 0
2.580.3
0.250.05
3
Name Plastic cap
Dimensions 52.2x6.4x0.7
4
Refractive index 1.5
1 The 1st valid pixel 2 The surface of the chip
The center of the pin1 The top of the cap The surface of the chip
3 The bottom of the package
4 Thickness of plastic cap over CCD chip 32C-1CCD-PKG3
Data Sheet S14374EJ1V0DS00
17
PD3778
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales offices. For more details, refer to our document "Semiconductor Device Mounting Technology Manual"(C10535E). Type of Through-hole Device
PD3778CY : CCD linear image sensor 32-pin plastic DIP (400 mil)
Process Partial heating method Conditions Pin temperature: 300 C or below, Heat time: 3 seconds or less (per pin)
Caution During assembly care should be taken to prevent solder or flux from contacting the plastic cap. The optical characteristics could be degraded by such contact.
18
Data Sheet S14374EJ1V0DS00
PD3778
NOTES ON CLEANING THE PLASTIC CAP
1 CLEANING THE PLASTIC CAP
Care should be taken when cleaning the surface to prevent scratches. The optical characteristics of the CCD will be degraded if the cap is scratched during cleaning. We recommend cleaning the cap with a soft cloth moistened with one of the recommended solvents below. Excessive pressure should not be applied to the cap during cleaning. If the cap requires multiple cleanings it is recommended that a clean surface or cloth be used.
2 RECOMMENDED SOLVENTS
The following are the recommended solvents for cleaning the CCD plastic cap. Use of solvents other than these could result in optical or physical degradation in the plastic cap. Please consult your sales office when considering an alternative solvent.
Solvents Ethyl Alcohol Methyl Alcohol Isopropyl Alcohol N-methyl Pyrrolidone
Symbol EtOH MeOH IPA NMP
Data Sheet S14374EJ1V0DS00
19
PD3778
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 STATUS BEFORE INITIALIZATION OF MOS DEVICES Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function.
20
Data Sheet S14374EJ1V0DS00
PD3778
[MEMO]
Data Sheet S14374EJ1V0DS00
21
PD3778
[MEMO]
22
Data Sheet S14374EJ1V0DS00
PD3778
[MEMO]
Data Sheet S14374EJ1V0DS00
23
PD3778
[MEMO]
* The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. * NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. * Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. * While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. * NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance.
M7 98.8

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